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Item type | Location | Call Number | Status | Notes | Date Due |
---|---|---|---|---|---|
Book | AUM Main Library | 621.381 T665 (Browse Shelf) | Available | JBC/2011/9269 | |
Book | AUM Main Library | 621.381 T665 (Browse Shelf) | Available | JBC/2011/9269 |
Includes bibliographical references and index.
Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.
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